Kweli phepha, iindlela zokungaphumeleli kunye neendlela zokungaphumeleli zamacandelo e-elektroniki ziyafundwa kwaye iimeko zabo ezisingqongileyo zinikwe ukubonelela ngereferensi ethile yoyilo lweemveliso zombane.
1. Iindlela zokusilela kwecandelo
Inombolo yesiriyeli
Igama lecandelo lombane
Iindlela zokusilela ezinxulumene nokusingqongileyo
Uxinzelelo lwendalo
1. Amacandelo e-Electromechanical
Ukungcangcazela kubangela ukudinwa kokuqhekeka kweekhoyili kunye nokukhulula iintambo.
Ukungcangcazela, ukothuka
2. Izixhobo ze-microwave zeSemiconductor
Ubushushu obuphezulu nomothuko wobushushu bukhokelela ekudibaneni phakathi kwempahla yephakheji kunye netshiphu, naphakathi kwemathiriyeli yepakethe kunye nojongano lwesibambi setshiphu yeplastiki etywiniweyo ye-microwave monolith.
Ubushushu obuphezulu, ukothuka kobushushu
3. Iisekethe ezihlanganisiweyo zeHybrid
Ukothuka kukhokelela ekuqhekekeni kwe-ceramic substrate, ukothuka kobushushu kukhokelela ekuqhekekeni kwe-capacitor ekupheleni kwe-electrode, kunye nokuhamba ngebhayisikile kobushushu kukhokelela ekungaphumeleli kwe-solder.
Ukothuka, umjikelo wobushushu
4. Izixhobo zeDiscrete kunye neeSekethe eziDityanisiweyo
Ukophuka kwe-thermal, ukusilela kwe-chip soldering, ukungaphumeleli kwekhonkco lokukhokela ngaphakathi, ukothuka okukhokelela ekuqhawukeni komgangatho we-passivation.
Ubushushu obuphezulu, ukothuka, ukungcangcazela
5. Amacandelo axhathisayo
Ukuqhekeka kwe-substrate engundoqo, ifilimu echasayo, i-lead breakage
Ukothuka, ubushushu obuphezulu nobuphantsi
6. Isekethe yenqanaba lebhodi
Amalungu e-solder aqhekekileyo, imingxuma yobhedu eyaphukileyo.
Ubushushu obuphezulu
7. Isitshixo sombane
Ukudinwa ukuphuka kocingo olushushu.
Ukungcangcazela
2, uhlalutyo lwendlela yokusilela kwecandelo
Imowudi yokusilela yamacandelo e-elektroniki ayiyonye, kuphela iyinxalenye yommeli wecandelo eliqhelekileyo locazululo lonyamezelo lwemekobume, ukuze ufumane isiphelo esibanzi.
2.1 Amalungu e-Electromechanical
Izinto eziqhelekileyo ze-electromechanical ziquka izihlanganisi zombane, ii-relays, njl. Iindlela zokungaphumeleli zicazululwa nzulu kunye nesakhiwo seentlobo ezimbini zamacandelo ngokulandelelana.
1) Izixhumi zombane
Isidibanisi sombane ngeqokobhe, isigqubuthelo kunye nomzimba woqhagamshelwano weeyunithi ezintathu ezisisiseko, imowudi yokusilela ishwankathelwa ngokusilela koqhagamshelwano, ukungaphumeleli kokugquma kunye nokungaphumeleli komatshini kwiintlobo ezintathu zokusilela.Ifom ephambili yokungaphumeleli kokudibanisa kombane ngenxa yokungaphumeleli koqhagamshelwano, ukungaphumeleli kokusebenza kwayo: ukudibanisa kwikhefu elikhawulezayo kunye nokuxhatshazwa koqhagamshelwano kwandisa.Kwiziqhagamshelo zombane, ngenxa yobukho bokuchasana koqhagamshelwano kunye nokumelana nomqhubi wezinto eziphathekayo, xa kukho ukuhamba kwangoku ngesidibanisi sombane, ukuxhathisa uqhagamshelwano kunye nokumelana nomqhubi wentsimbi kuya kuvelisa ubushushu beJoule, ubushushu beJoule buya kwandisa ubushushu, kubangele ukwanda kombane. ubushushu bendawo yoqhagamshelwano, iqondo lobushushu eliphezulu kakhulu liya kwenza indawo yokunxibelelana yentsimbi ithambe, inyibilike okanye ibilise, kodwa ikwandise ukumelana noqhagamshelwano, ngaloo ndlela ibangela ukusilela koqhagamshelwano..Kwindima yendawo yobushushu obuphezulu, iindawo zoqhagamshelwano nazo ziya kubonakala i-creep phenomenon, yenza uxinzelelo loqhagamshelwano phakathi kweendawo zoqhagamshelwano lunciphe.Xa uxinzelelo loqhagamshelwano luncitshiswe kwinqanaba elithile, ukuchasana koqhagamshelwano kuya kunyuka ngokukhawuleza, kwaye ekugqibeleni kubangele uqhagamshelwano olubi lombane, okubangela ukungaphumeleli koqhagamshelwano.
Kwelinye icala, isinxibelelanisi sombane kwindawo yokugcina, uthutho kunye nomsebenzi, siya kuxhomekeka kwiintlobo ngeentlobo zemithwalo yokungcangcazela kunye nempembelelo yempembelelo, xa umthwalo wokungcangcazela wangaphandle uphinda uvuse isantya kunye nezihlanganisi zombane kufutshane nezande zendalo, ziya kwenza iresonance yombane. isenzeko, okubangela umsantsa phakathi kweziqwenga zoqhagamshelwano ziba nkulu, umsantsa uyanda ukusa kumlinganiselo othile, uxinzelelo loqhagamshelwano luya kunyamalala ngoko nangoko, okubangela uqhagamshelwano lombane "ikhefu elikhawulezayo".Kwi-vibration, umthwalo wokuthuthumela, umdibaniso wombane uya kuvelisa uxinzelelo lwangaphakathi, xa uxinzelelo ludlula amandla okuvelisa izinto eziphathekayo, luya kwenza umonakalo kunye nokuphuka;kwindima yolu xinzelelo lwexesha elide, izinto ziya kwenzeka kwakhona umonakalo wokudinwa, kwaye ekugqibeleni kubangele ukusilela.
2) Ukudluliselwa
Iireyilayi ze-Electromagnetic zibandakanya ii-cores, iikhoyili, ii-armatures, abafowunelwa, iingcongolo njalo njalo.Logama nje i-voltage ethile yongezwa kuzo zozibini iziphelo zekhoyili, umsinga othile uya kuhamba kwikhoyili, ngaloo ndlela uvelise isiphumo sombane, i-armature iya koyisa amandla ombane wokutsala umdla wokubuyela kutsalo lwasentwasahlobo ukuya kumbindi. yona iqhuba abafowunelwa abahambayo bezixhobo kunye nabafowunelwa abangatshintshiyo (abadla ngokuvula abafowunelwa) ukuvala.Xa ikhoyili icinyiwe, amandla okufunxa nge-electromagnetic nawo ayanyamalala, i-armature iya kubuyela kwindawo yokuqala phantsi kwamandla okusabela entwasahlobo, ukuze uqhagamshelwano olushukumayo kunye noqhagamshelwano olusisigxina lwe-static (uqhagamshelwano oluqhele ukuvaleka) ukufunxa.Oku kutsala kunye nokukhululwa, ngaloo ndlela kufezekiswa injongo yokuqhuba kunye nokunqunyulwa kwisekethe.
Ezona ndlela ziphambili zokungaphumeleli ngokubanzi kokuhanjiswa kombane zezi: ukuhanjiswa kombane okuqhele ukuvuleka, ukugqithiselwa kombane ngokuqhelekileyo kuvalwe, intshukumo yentwasahlobo eguqukayo ayifikeleli kwiimfuno, ukuvalwa koqhagamshelwano emva kokuba iiparamitha zombane ezidluliswayo zigqithise kumbi.Ngenxa yokunqongophala kwenkqubo yokuvelisa i-electromagnetic relay, uninzi lokungaphumeleli kwe-electromagnetic relay kwinkqubo yokuvelisa ukubeka umgangatho weengozi ezifihliweyo, ezifana nexesha lokunciphisa uxinzelelo lomatshini lifutshane kakhulu elikhokelela kulwakhiwo lomatshini emva kokuguqulwa kwamalungu okubumba, ukususwa kwentsalela akupheli. kubangele uvavanyo lwe-PIND aluphumelelanga okanye lungaphumeleli, uvavanyo lwefektri kunye nokusetyenziswa kokuhlolwa alukho ngqongqo ukwenzela ukuba ukusilela kwesixhobo ekusebenziseni, njl.Kuyilo lwezixhobo eziqulethe iireyidi, kuyafuneka ukuba kugxininiswe kwimpembelelo yokuguquguquka kokusingqongileyo ukuze kuqwalaselwe.
2.2 Amalungu e-microwave eSemiconductor
Izixhobo ze-semiconductor ze-Microwave ngamalungu enziwe nge-Ge, Si kunye ne-III ~ V yezinto eziphathekayo ze-semiconductor ezisebenza kwibhendi ye-microwave.Zisetyenziswa kwizixhobo zombane ezifana nerada, iisistim zemfazwe ye-elektroniki kunye neenkqubo zonxibelelwano nge-microwave.I-Microwave discrete ukupakishwa kwesixhobo ukongeza ekuboneleleni ngoqhagamshelo lombane kunye nokhuseleko lomatshini kunye nekhemikhali kumbindi kunye nezikhonkwane, uyilo kunye nokukhethwa kwendlu kufuneka kuthathelwe ingqalelo impembelelo yeeparamitha zezindlu kwiimpawu zothumelo lwe-microwave zesixhobo.Indlu ye-microwave nayo iyinxalenye yesekethe, yona ngokwayo eyenza igalelo elipheleleyo kunye nesekethe yemveliso.Ngoko ke, imilo kunye nesakhiwo sendlu, ubungakanani, izinto ze-dielectric, ukulungiswa kwe-conductor, njl. Kufuneka zihambelane neempawu ze-microwave zamacandelo kunye nemiba yesicelo sesekethe.Ezi zinto zimisela iiparitha ezifana ne-capacitance, ukunyanzeliswa kombane, i-impedance yeempawu, kunye nokulahleka kwe-conductor kunye ne-dielectric yezindlu ze-tube.
Iimowudi ezifanelekileyo zokusingqongileyo kunye neendlela zamacandelo e-microwave semiconductor ikakhulu zibandakanya isinki yentsimbi yesango kunye nokuthotywa kweempawu ezixhathisayo.Isinki yentsimbi yesango kungenxa yokusasazwa okukhawulezileyo kwentsimbi yesango (Au) kwii-GaAs, ke le ndlela yokusilela yenzeka ikakhulu ngexesha lovavanyo olukhawulezileyo lobomi okanye ukusebenza kobushushu obuphezulu kakhulu.Isantya sentsimbi yesango (Au) yokusasazwa kwi-GaAs ngumsebenzi we-coefficient yokusasazwa kwesixhobo sesinyithi sesango, ubushushu, kunye ne-gradient yoxinzelelo lwempahla.Kulwakhiwo olugqibeleleyo lwelethisi, ukusebenza kwesixhobo akuchatshazelwa liqondo elicothayo losasazo kumaqondo obushushu aqhelekileyo okusebenza, nangona kunjalo, izinga losasazo linokubaluleka xa imida yamasuntswana mikhulu okanye kukho iziphene ezininzi kumphezulu.I-Resistors isetyenziswa ngokuqhelekileyo kwiisekethe ezidibeneyo ze-microwave monolithic kwiisekethe zempendulo, ukuseta indawo yokutyela yezixhobo ezisebenzayo, ukwahlula, ukudibanisa amandla okanye ukuphela kokudibanisa, kukho izakhiwo ezibini zokuchasana: ukuxhathisa ifilimu yesinyithi (i-TaN, i-NiCr) kunye ne-GaAs edope kancinane. ukuxhathisa umaleko omncinci.Uvavanyo lubonisa ukuba ukuthotywa kokumelana kwe-NiCr okubangelwa kukufuma yeyona ndlela iphambili yokungaphumeleli kwayo.
2.3 Iisekethe ezihlanganisiweyo zeHybrid
Imijikelezo edibeneyo ye-hybrid yemveli, ngokutsho kumphezulu we-substrate ye-tape yesikhokelo sefilimu eshinyeneyo, inkqubo ye-tape yesikhokelo sefilimu ebhityileyo yahlulwe ibe ziindidi ezimbini zeesekethe ezishinyeneyo ezihlanganisiweyo zefilimu kunye neesekethe ezibhityileyo ezihlanganisiweyo zefilimu: ibhodi yesekethe encinci eprintiweyo (PCB) isekethe, ngenxa yesekethe eprintiweyo ikwimo yefilimu kumphezulu webhodi ethe tyaba ukwenza ipateni yokuqhuba, ikwahlelwa njengemibhobho ehlanganisiweyo ehlanganisiweyo.Ngokuvela kwamacandelo e-multi-chip le sekethe edibeneyo ye-hybrid edityanisiweyo, i-substrate yayo ekhethekileyo ye-multi-layer ye-wiring yesakhiwo kunye ne-teknoloji yenkqubo yomngxuma, yenze amacandelo abe yisekethe edibeneyo edibeneyo kwisakhiwo soqhagamshelwano oluphezulu oluhambelana ne-substrate esetyenzisiweyo. kumacandelo e-multi-chip kwaye aquka: ifilimu ebhityileyo i-multilayer, ifilimu eninzi, i-high-temperature co-fired, i-low-temperature co-fired, i-silicon-based, i-PCB ye-multilayer substrate, njl.
Iindlela zokungaphumeleli koxinzelelo lwesekethe edibeneyo yokusingqongileyo ibandakanya ukungaphumeleli kwesekethe evulekileyo yombane okubangelwa kukuqhekeka kwe-substrate kunye nokungaphumeleli kwe-welding phakathi kwamacandelo kunye nabaqhubi befilimu ezishinyeneyo, amacandelo kunye nabaqhubi befilimu abancinci, i-substrate kunye nezindlu.Impembelelo yomatshini ukusuka ekuweni kwemveliso, ukothuka kwe-thermal ukusuka ekusebenzeni kwe-soldering, uxinzelelo olongezelelweyo olubangelwa ukungalingani kwe-warpage ye-substrate, uxinzelelo lwe-lateral tensile ukusuka ekungahambisanini kwe-thermal phakathi kwe-substrate kunye nezindlu zetsimbi kunye ne-bonding material, uxinzelelo lomatshini okanye uxinzelelo lwe-thermal olubangelwa ziziphene zangaphakathi ze-substrate, umonakalo onokwenzeka. okubangelwa kukugrumba i-substrate kunye ne-substrate yokusika iintanda zengingqi, ekugqibeleni kukhokelela kuxinzelelo lwangaphandle lomatshini omkhulu kunamandla omatshini we-ceramic substrate ukuba Isiphumo sisilele.
Izakhiwo ze-Solder zichaphazeleka kuxinzelelo oluphindaphindiweyo lokuhamba ngebhayisikile, oku kunokukhokelela ekudinweni kwe-thermal kwi-solder layer, okukhokelela ekunciphiseni amandla okubambisana kunye nokwanda kokumelana nokushisa.Kwiklasi esekelwe kwi-tin ye-ductile solder, indima yoxinzelelo lwe-cyclic yobushushu ikhokelela ekudinweni kwe-thermal ye-solder layer ngenxa ye-coefficient yokwandiswa kwe-thermal yezakhiwo ezibini ezidityaniswe yi-solder ayihambelani, yi-solder displacement deformation okanye i-shear deformation, emva ngokuphindaphindiweyo, umaleko solder kunye ukudinwa crack ukwandiswa kunye nokwandiswa, ekugqibeleni kukhokelela ukusilela ukudinwa umaleko solder.
2.4 Izixhobo ezikhethekileyo kunye neesekethe ezidibeneyo
Izixhobo ze-Semiconductor discrete zihlulwe zibe yi-diode, i-bipolar transistors, iityhubhu ze-MOS field effect, i-thyristors kunye ne-insulated gate bipolar transistors ngamacandelo abanzi.Iisekethe ezidibeneyo zinoluhlu olubanzi lwezicelo kwaye zinokwahlulwa zibe ngamacandelo amathathu ngokwemisebenzi yazo, ezizezi, iisekethe ezidityanisiweyo zedijithali, iisekethe ezidibeneyo ze-analog kunye neesekethe ezidibeneyo zedijithali-analog.
1) Izixhobo ezikhethekileyo
Izixhobo ezidityanisiweyo ziziintlobo ngeentlobo kwaye zinento ethile yazo ngenxa yemisebenzi yazo eyahlukeneyo kunye neenkqubo, ezinomahluko omkhulu ekusebenzeni kokusilela.Nangona kunjalo, njengezixhobo ezisisiseko ezenziwe ziinkqubo ze-semiconductor, kukho ukufana okuthile kwifiziksi yazo yokungaphumeleli.Iintsilelo eziphambili ezinxulumene nobuchwephesha bangaphandle kunye nokusingqongileyo kwendalo kukuqhekeka kwe-thermal, i-avalanche eguquguqukayo, ukungaphumeleli kwe-chip soldering kunye nokungaphumeleli kokubambisana kwangaphakathi.
Ukuqhekeka kwe-Thermal: Ukuqhekeka kwe-thermal okanye ukwaphuka kwesibini yeyona ndlela iphambili yokungaphumeleli echaphazela izixhobo zamandla e-semiconductor, kwaye uninzi lomonakalo ngexesha lokusetyenziswa luhambelana nesiganeko sokuqhekeka kwesibini.Ukuqhekeka okwesibini kwahlulahlulwe kucalucalulo oluphambili lwesibini kunye nohlengahlengiso olusemva lwesibini.Eyangaphambili inxulumene ikakhulu nezixhobo zobushushu zesixhobo, ezinje ngoxinaniso lwedoping yesixhobo, ugxininiso lwangaphakathi, njl.njl., ngelixa le yokugqibela inxulumene nophindaphindo lwe-avalanche yabathwali kwindawo yentlawulo yesithuba (efana kufutshane nomqokeleli), zombini. ezihlala zihamba kunye noxinaniso lwangoku ngaphakathi kwesixhobo.Ekusetyenzisweni kwamacandelo anjalo, ingqalelo ekhethekileyo kufuneka ihlawulwe ekukhuselweni kwe-thermal kunye nokutshatyalaliswa kokushisa.
I-avalanche eDynamic: Ngexesha lokuvalwa okuguquguqukayo ngenxa yamandla angaphandle okanye angaphakathi, into elawulwa ngoku ye-ionization ye-ionization elawulwa ngoku eyenzeka ngaphakathi kwisixhobo esiphenjelelwa yi-concentration carrier carrier ibangela i-avalanche eguquguqukayo, enokuthi yenzeke kwizixhobo ze-bipolar, i-diode kunye ne-IGBTs.
Ukungaphumeleli kwe-Chip solder: Isizathu esona sizathu kukuba i-chip kunye ne-solder zizinto ezahlukeneyo kunye ne-coefficients eyahlukeneyo yokwandiswa kwe-thermal, ngoko kukho ukungahambi kakuhle kwe-thermal kumaqondo aphezulu.Ukongeza, ubukho be-solder voids kwandisa ukuxhathisa kwe-thermal yesixhobo, ukwenza ukutshatyalaliswa kobushushu kubi kwaye kubangele amabala ashushu kwindawo yendawo, ukuphakamisa ubushushu be-junction kwaye kubangele ukusilela okunxulumene nobushushu obufana ne-electromigration.
Ukungaphumeleli kwe-inner lead bonding: ubukhulu becala ukungaphumeleli kwe-corrosion kwindawo yokudibanisa, okubangelwa ukubola kwe-aluminiyam okubangelwa isenzo somphunga wamanzi, izakhi zeklorine, njl. kwindawo yokutshiza ityuwa eshushu kunye nefumileyo.Ukudinwa ukuphuka kwe-aluminium bonding kukhokelela kumjikelezo wobushushu okanye ukungcangcazela.I-IGBT kwipakethe yemodyuli inkulu ngobukhulu, kwaye ukuba ifakwe ngendlela engafanelekanga, kulula kakhulu ukubangela uxinzelelo lwexinzelelo, okubangelwa ukukhathala kokuphuka kwesikhokelo sangaphakathi semodyuli.
2) Isekethe edibeneyo
Indlela yokungaphumeleli kweesekethe ezidibeneyo kunye nokusetyenziswa kokusingqongileyo kunobudlelwane obukhulu, ukufuma kwindawo efumileyo, umonakalo oveliswa ngumbane ongatshintshiyo okanye ukushukuma kombane, ukusetyenziswa okuphezulu kakhulu kombhalo kunye nokusetyenziswa kweesekethe ezidibeneyo kwindawo engqongileyo ngaphandle kwemitha. ukomelezwa kokumelana nako kunokubangela ukusilela kwesixhobo.
Iimpembelelo ze-Interface ezihambelana ne-aluminium: Kwizixhobo zombane ezinezixhobo ezisekelwe kwi-silicon, i-SiO2 i-layer njengefilimu ye-dielectric isetyenziswa kakhulu, kwaye i-aluminium isoloko isetyenziswa njengesixhobo sokudibanisa imigca, i-SiO2 kunye ne-aluminium kumaqondo aphezulu okushisa kuya kuba yi-chemical reaction, ukuze umaleko we-aluminium ube mncinci, ukuba umaleko we-SiO2 uphelelwe ngenxa yokusetyenziswa kokusabela, uya kubangela uqhagamshelwano oluthe ngqo phakathi kwe-aluminium kunye ne-silicon.Ukongeza, intambo yegolide yegolide kunye nomgca wokudibanisa i-aluminium okanye i-aluminium yokudibanisa intambo kunye nokudityaniswa kwentambo yegolide efakwe kwigobolondo ye-tube, iya kuvelisa i-Au-Al interface.Ngenxa yamandla ahlukeneyo ekhemikhali kwezi zinyithi zimbini, emva kokusetyenziswa kwexesha elide okanye ukugcinwa kumaqondo obushushu aphezulu ngaphezulu kwe-200 ℃ kuya kuvelisa iintlobo ngeentlobo zeekhompawundi ze-intermetallic, kwaye ngenxa ye-lattice constants kunye nokwandiswa kwe-thermal coefficients kuyahluka, kwindawo yokudibanisa ngaphakathi. uxinzelelo olukhulu, i-conductivity iba yincinci.
I-Metallization Corrosion: Umgca wokudityaniswa kwe-aluminiyam kwitshiphu usemngciphekweni wokonakala ngumphunga wamanzi kwindawo eshushu nefumileyo.Ngenxa yokunciphisa ixabiso kunye nokuveliswa kobunzima obulula, iisekethe ezininzi ezidibeneyo zifakwe kwi-resin, nangona kunjalo, umphunga wamanzi unokudlula kwi-resin ukuze ufikelele kwi-aluminium interconnects, kunye nokungcola okungeniswa ngaphandle okanye kunyibilikisiwe kwisenzo se-resin kunye ne-aluminium yensimbi ukuze kubangele. ukubola koqhagamshelwano lwe-aluminiyam.
Impembelelo ye-delamination ebangelwa ngumphunga wamanzi: iplastiki ye-IC yisekethe edibeneyo ehlanganiswe ngeplastiki kunye nezinye izinto ze-polymer ze-resin, ukongeza kwimpembelelo ye-delamination phakathi kwezinto zeplastiki kunye nesakhelo sesinyithi kunye ne-chip (eyaziwa ngokuba yi "popcorn") ngenxa yokuba izinto ze-resin zineempawu zokungeniswa komphunga wamanzi, umphumo we-delamination obangelwa yi-adsorption yomphunga wamanzi uya kubangela ukuba isixhobo singaphumeleli..Indlela yokungaphumeleli kukwandiswa ngokukhawuleza kwamanzi kwizinto zokutywinwa kweplastiki kumaqondo aphezulu okushisa, ukwenzela ukuba ukwahlukana phakathi kweplastiki kunye nokudibanisa kwayo kwezinye izinto, kwaye kwiimeko ezinzima, umzimba wokutywina weplastiki uya kuqhuma.
2.5 Amacandelo e-Capacitive resistive
1) Abaxhathisi
Izichasi eziqhelekileyo ezingajikiyo zinokwahlulwa zibe ziindidi ezine ngokwezixhobo ezahlukeneyo ezisetyenziswa kumzimba ochasayo, ezizezi, uhlobo lwengxubevange, uhlobo lwefilimu, uhlobo lwefilimu eshinyeneyo kunye nohlobo lokwenziwa.Kwii-resistors ezisisigxina, iindlela eziphambili zokungaphumeleli ziyisekethe evulekileyo, i-parameter drift yombane, njl.;ngelixa i-potentiometers, iindlela eziphambili zokungaphumeleli ziyisekethe evulekileyo, i-parameter drift yombane, ukunyuka kwengxolo, njl njl. Indawo yokusetyenziswa iya kukhokelela ekugugeni kwe-resistor, enempembelelo enkulu kubomi bezixhobo zombane.
I-Oxidation: I-oxidation ye-resistor body iya kwandisa ixabiso lokumelana kwaye yeyona nto ibalulekileyo ebangela ukuguga kokumelana.Ngaphandle kwemizimba exhathisayo eyenziwe ngeentsimbi ezixabisekileyo kunye ne-alloys, zonke ezinye izinto ziya konakaliswa yioksijini emoyeni.I-oxidation sisiphumo sexesha elide, kwaye xa impembelelo yezinye izinto iyancipha ngokuthe ngcembe, i-oxidation iya kuba yinto ephambili, kwaye ubushushu obuphezulu kunye neendawo zokufuma eziphezulu ziya kukhawulezisa i-oxidation ye-resistors.Kwizinto ezichasayo ezichasayo kunye nexabiso eliphezulu lokuxhathisa, umlinganiselo osisiseko wokuthintela i-oxidation kukhuseleko lokutywina.Izinto zokutywina kufuneka zibe zizixhobo ezingabonakaliyo, ezifana nentsimbi, i-ceramic, iglasi, njl njl. Umaleko wokukhusela owenziweyo awukwazi ukuthintela ngokupheleleyo ukunyameka komswakama kunye nokungena komoya, kwaye unokudlala indima yokulibaziseka kwi-oxidation kunye ne-adsorption.
Ukuguga kwe-binder: Kwizinto ezichasayo ze-organic synthetic, ukuguga kwe-organic binder yeyona nto iphambili echaphazela ukuzinza kwe-resistor.Isibophelelo sezinto eziphilayo ikakhulu yintlaka yokwenziwa, eguqulwa ibe yipolymer ene-polymerized thermosetting ngonyango lobushushu ngexesha lenkqubo yokwenziwa kwe-resistor.Eyona nto ibangela ukuguga kwepolymer yi-oxidation.I-radicals yamahhala eveliswa yi-oxidation ibangela ukuba i-hinging ye-polymer bond molecular bond, ethi iphinde iphilise i-polymer kwaye iyenze ibe brittle, okukhokelela ekulahlekeni kwe-elasticity kunye nomonakalo womatshini.Ukunyangwa kwe-binder kubangela ukuba i-resistor iyancipha umthamo, inyusa uxinzelelo loqhagamshelwano phakathi kwamasuntswana aqhubayo kunye nokunciphisa ukuchasana koqhagamshelwano, okukhokelela ekunciphiseni ukuchasana, kodwa umonakalo womatshini kwi-binder nawo unyusa ukuxhathisa.Ngokuqhelekileyo ukunyangwa kwe-binder kwenzeka ngaphambili, umonakalo owenziwe ngoomatshini uyenzeka emva koko, ngoko ixabiso lokumelana ne-organic synthetic resistors libonisa le pateni ilandelayo: ezinye ziyancipha ekuqaleni kwesigaba, emva koko zijika zinyuka, kwaye kukho ukuthambekela kokunyuka.Kuba ukuguga kweepolymers kunxulumene ngokusondeleyo nobushushu kunye nokukhanya, izichasi zokwenziwa ziya kukhawulezisa ukuguga phantsi kobushushu obuphezulu kunye nokuvezwa kokukhanya okunamandla.
Ukuguga phantsi komthwalo wombane: Ukusebenzisa umthwalo kwi-resistor kuya kukhawulezisa inkqubo yokuguga.Ngaphantsi komthwalo we-DC, isenzo se-electrolytic singonakalisa izixhasi zefilimu ezincinci.I-Electrolysis yenzeke phakathi kweendawo zokubeka i-resistor slotted, kwaye ukuba i-resistor substrate yi-ceramic okanye i-glass material equkethe i-ion ye-alkali yesinyithi, ii-ion zihamba phantsi kwesenzo sentsimi yombane phakathi kweendawo zokubeka.Kwimekobume efumileyo, le nkqubo iqhubela phambili ngobundlobongela.
2) IiCapacitors
Iimowudi zokungaphumeleli kwee-capacitors yisekethe emfutshane, isekethe evulekileyo, ukuthotywa kweeparamitha zombane (kubandakanywa nokutshintsha komthamo, ukonyuka kwe-angle yelahleko ye-tangent kunye nokuncipha kokunganyangeki kokugquma), ukuvuza kolwelo kunye nokuqhekeka komhlwa okukhokelela.
Isiphaluka esifutshane: I-arc ehambayo emphethweni phakathi kweepali kwiqondo lokushisa eliphezulu kunye noxinzelelo lomoya oluphantsi luya kukhokelela kwisiphaluka esifutshane se-capacitors, ngaphezu koko, uxinzelelo lomatshini olufana nokutshatyalaliswa kwangaphandle luya kubangela isiphaluka esifutshane se-dielectric.
Isekethe evulekileyo: I-Oxidation yeengcingo ezikhokelayo kunye noqhagamshelwano lwe-electrode olubangelwa yindawo emanzi kunye neshushu, okubangela ukufikeleleka kwinqanaba eliphantsi kunye nokuphuka kwe-corrosion ye-anode lead foil.
Ukuthotywa kweeparamitha zombane: Ukuthotywa kweeparamitha zombane ngenxa yempembelelo yendawo efumileyo.
2.6 Isekethe yenqanaba lebhodi
Ibhodi yesekethe eprintiweyo ikakhulu iqulunqwe substrate insulating, iingcingo zetsimbi kunye nokudibanisa umaleko ezahlukeneyo iingcingo, amacandelo solder "pads".Indima yayo ephambili kukubonelela nge-carrier yamacandelo e-elektroniki, kunye nokudlala indima yokudibanisa kombane kunye noomatshini.
Imowudi yokusilela kwebhodi yesekethe eprintiweyo ikakhulu ibandakanya ukusoda okulambathayo, ukuvuleka kunye nesekethe emfutshane, amadyungudyungu, ukugqabhuka kwebhodi delamination, umhlwa umphezulu webhodi okanye umbala, ukugoba ibhodi.
Ixesha lokuposa: Nov-21-2022